Bell Semiconductors filed another patent infringement suit against AMD, asserting U.S. Patent No. 7,396,760, titled “Method and System for Reducing Inter-Layer Capacitance in Integrated Circuits.” Bell asserts that this patent, like previous patens asserted by Bell against AMD, was used to design AMD’s Ryzen 7 1700 and Ryzen 5 processor devices. The patented technology is said to cover a design process that minimizes interlayer bulk capacitance by considering the capacitance while arranging dummy fill in the chip so that the dummy layers do not align vertically in successive layers.
As with previous filings, Bell touts its history as successor to Bell Labs and to its large number of patents as evidence of its technological prowess, the ‘760 patent originated with LSI Logic, and was not acquired by Bell Semiconductor until 2017.
Bell has filed three prior suits against AMD in Massachusetts, including one just last month. It is unclear why Bell files serially on individual patents instead of consolidating them into a single complaint.
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